IGBT (Insulated Gate Bipolar Transistor), also known as Insulated Gate Bipolar Transistor, is composed of BJT (Bipolar Junction Transistor) and MOS (Insulated Gate Field Effect Transistor). It is the core device for energy conversion and transmission. It is also called The "CPU" of a power electronic device.
IGBT is an important component of equipment such as electric vehicles and charging piles and plays a vital role. According to statistics, IGBT accounts for about 10% of the cost of electric vehicles and about 20% of the cost of charging piles. So, let us take a look at what areas are IGBT mainly used in electric vehicles?
Charging pile: IGBT modules are used as switching elements in smart charging piles
1. Electric control system: high-power DC/AC (DC/AC) inverter drive car motor
2. Vehicle air conditioning control system: low-power DC/AC inverter, using IGBT and FRD with smaller current
3. What are the key requirements for IGBT copper base plate?
1. Heat dissipation coefficient: The most important function of the IGBT copper base plate is heat dissipation, so the heat dissipation performance of the material is key.
2. Electroplating performance: The quality of nickel plating has a great influence on the mechanical properties and welding quality of the base plate.
3. Welding performance: The copper base plate is assembled to the IGBT module through welding, so a certain space for thermal deformation needs to be reserved.
4. Thickness requirements: Thickness requirements: There are differences in the heat dissipation effects of copper base plates of different thicknesses. Considering the cost, there are differences in the heat dissipation effects of copper base plates of different thicknesses. Considering the cost, there is an optimal thickness. Optimum thickness.
(1) When the chip is working, heat is transferred to the thick copper substrate through the DBC liner. The copper substrate can increase the heat flow and transfer it downward to the heat sink structure (spoiler column). The heat sink structure has a large surface area and can transmit to the surrounding environment. Quickly dissipate heat and reduce chip junction temperature.
(2) Among chips, DBC lining boards, and copper substrates, copper substrates have the highest overall heat dissipation efficiency and the largest amount of consumables. A high-performance copper material is crucial.
Due to the high-voltage and high-frequency working environment, the performance of the radiator is directly related to the working performance of the IGBT power module. Therefore, thermal design is a top priority. Radiators on the market usually use copper or aluminum. Because the thermal conductivity of copper is more than twice that of aluminum, copper has become the mainstream heat dissipation material for high-end IGBTs.
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Jintian Copper is a reliable partner of customers and can assist customers in jointly developing materials and reducing costs.
